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This e-book focuses on the use of organic materials in fabricating plastic electronics (PE) for use in packaging applications. It looks at emerging developments in functional inks, substrates and printing processes for creating such devices as displays, RFID, power sources and sensors. The e-book addresses packaging requirements in key end-use sectors such as food, beverage and personal care, and the drivers and challenges in integrating PE into the existing supply chain. It also considers next-generation ink and backplane materials, communication protocols and recycling concerns.
Executive summary
Introduction and methodology
- Report scope
- Report objective
- Methodology
- Glossary of terms
The plastic electronics industry
- Organic electronics devices
- Cost advantages of PE
- Drivers and challenges
- Investment in PE
Material and processing developments
- Functional inks
- Conductors
- Semiconductors
- Dielectrics
- Substrates
- Manufacturing processes
- Printing processes
- Soft lithography
- Gravure
- Offset lithography
- Screen printing
- Thermal ablation
Packaging applications for plastic electronics
- Trends in key sectors
- Food
- Beverage
- Non-food
- Pharmaceutical
- Personal care
- Plastic electronic devices
- Displays
- Sensors
- RFID
- Power
- Memory
- Security/Protection
Outlook to 2020
- Emerging ink and backplane materials
- Cost/performance in packaging
- Environmental concerns (RoHS, recycling)
- Standards, communication protocols